Syenta, an Australian semiconductor company developing advanced packaging technology for AI systems, announced an A$37 million (US$26 million) Series A round led by Playground Global and National Reconstruction Fund, with participation from Investible, Salus Ventures, Jelix Ventures, and Wollemi Capital.
The new financing brings total capital raised to A$51.1 million (US$36.4 million) as Syenta advances toward commercialization and international expansion.
As part of the round, Pat Gelsinger, General Partner at Playground Global and former CEO of Intel, will join Syenta’s board. Funding will also support the launch of US operations in Arizona, placing the company closer to major semiconductor customers and packaging ecosystems.
Technology Focus
Syenta’s Localized Electrochemical Manufacturing (LEM) platform is designed to improve chip-to-chip interconnect density using existing semiconductor production infrastructure. Early results show micron-scale interconnects, up to 40% fewer process steps, no need for fab redesigns, and higher bandwidth between chips.
By integrating with current manufacturing environments, the company aims to increase advanced packaging scalability while easing pressure on limited global supply chains.
Industry Need
As AI systems grow larger, performance limits are increasingly linked to how chips communicate rather than compute power alone. Interconnect bandwidth, packaging density, and chiplet-based architectures are becoming critical challenges across the semiconductor sector.
“This is a new way of building high-performance systems at unprecedented scale and power, particularly as AI workloads continue to grow,” said Pat Gelsinger, General Partner at Playground Global.
“AI’s next scaling challenge isn’t just compute — it’s how chips connect. Syenta is addressing a fundamental constraint in advanced packaging, and that has the potential to reshape how future systems are built and scaled.”
Australian Manufacturing Support
“Syenta exemplifies the type of globally competitive, high-impact innovation the NRF was created to support,” said Dr Mary Manning, Chief Investment Officer at the NRF.
“By advancing next-generation packaging technologies, Syenta strengthens Australia’s role in critical supply chains while contributing to global semiconductor resilience.”
Commercial Growth Plans
Syenta’s Arizona expansion is intended to accelerate partnerships with global manufacturers while strengthening semiconductor supply chains across the United States and Australia as demand for AI infrastructure continues to rise.